工作职责：

Job Overivew: ● Package engineer work with supplier and OVT internal teams to solve assembly process related issue, yield improvement and cost-effective and safe packaging for products. ● Responsible for IC Package development, qualification, and volume production ● Perform package feasibility studies for all NPI (new product introduction) and direct interface with multiple assembly subcontractors as well as die design groups, product engineering, marketing and business units ● Perform technical assessments at supplier’s facilities ● Conduct risk and capability assessment to assign appropriate actions and tools for supplier development ● Drive a quality culture aligned to Zero Defect with suppliers for automotive process ● Evaluate and develop new packaging materials and processes ● Interface with packaging assembly and substrate suppliers for new product bring-up, qualification and production ramp ● Work close with QA and customers to resolve quality issues

任职资格：

● At least 8 years of assembly and packaging engineering experiences including advanced pkg development is required ● This job requires travel that may be for extended periods ● May be required to work extended hours on occasion ● Good project management, communication and leadership skills ● Experience with System In Package requirements preferred ● Knowledge of InFo and CoWoS technology preferred ● Knowledge of Lithography and Etching process concept preferred