工作职责：

1. Perform wafer level characterization for CMOS imaging sensors
2. Drive Test Program setup, validate CP (Chip Probe) result, and establish setting correlation
3. Analyze sensor performance data and debug issues leading to root cause findings
4. Validate design features and proceed with CP implementation
5. Work with Product Engineer on testing coverage, Spec and yield improvement for MP (Mass Production)
5. Develop and maintain automation tools (such as macro, scripts etc.)
6. Support corner lot testing and MP case review
7. Performs other duties as assigned

任职资格：

1. Master Degree in Electrical Engineering, or equivalent work experience
2. Minimum of 2-year experience in semiconductor product engineering
3. Knowledge in semiconductor fabrication process, or wafer/package level ATE testing
4. Good analytical skills and experience in volume data analysis
5. Knowledge in CMOS image sensor is a plus
6. Knowledge in script language (such as Python, Perl or VBA) is a plus
7. Good communication skills (in English & Chinese).